IC testing packages require increased size and greater precision in silicon wafer pad positioning to reduce the number of tests. These test tool ceramic packages are used in running electrical tests with probes (needles) brought into contact with IC (wafer) terminals. They are used as relay substrates to mechanically and electrically connect the probe and PCB in the probe card.

Thin film technologies are used to form high-precision terminals on alumina ceramic multilayer substrates of over 20 layers.

The global Ceramic Substrates for Probe Cards market size is projected to grow from US$ 26.4 million in 2024 to US$ 38.6 million in 2030; it is expected to grow at a CAGR of 6.5% from 2024 to 2030.

ReportPrime's newest research report, the “Ceramic Substrates for Probe Cards Industry Forecast” looks at past sales and reviews total world Ceramic Substrates for Probe Cards sales in 2023, providing a comprehensive analysis by region and market sector of projected Ceramic Substrates for Probe Cards sales for 2024 through 2030.

This Insight Report provides a comprehensive analysis of the global Ceramic Substrates for Probe Cards landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity.

This report also analyzes the strategies of leading global companies with a focus on Ceramic Substrates for Probe Cards portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Ceramic Substrates for Probe Cards market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Ceramic Substrates for Probe Cards and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity.

• Segmentation by Type:
1. Size: 300mm
2. Others Size: 200mm and 150mm

• Segmentation by Application:
1. DRAM Wafer Probe Card
2. Flash Memory Wafer Probe Card
3. Logic Device (4-DUT) Wafer Probe Card
4. Others

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration:

• Kyocera
• SEMCNS Co., Ltd
• Niterra (NTK)
• Serim Tech Inc
• LTCC Materials
• Shanghai Zenfocus Semi-Tech

Key Questions Addressed in this Report

• What is the 10-year outlook for the global Ceramic Substrates for Probe Cards market?
• What factors are driving Ceramic Substrates for Probe Cards market growth, globally and by region?
• Which technologies are poised for the fastest growth by market and region?
• How do Ceramic Substrates for Probe Cards market opportunities vary by end market size?
• How does Ceramic Substrates for Probe Cards break out by Type, by Application?