As the global economy mends, the 2021 growth of Underfill will have significant change from previous year. According to our (LP Information) latest study, the global Underfill market size is USD million in 2022 from USD 432.9 million in 2021, with a change of % between 2021 and 2022. The global Underfill market size will reach USD 559.5 million in 2028, growing at a CAGR of 3.7% over the analysis period.
The United States Underfill market is expected at value of US$ million in 2021 and grow at approximately % CAGR during review period. China constitutes a % market for the global Underfill market, reaching US$ million by the year 2028. As for the Europe Underfill landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period. In APAC, the growth rates of other notable markets (Japan and South Korea) are projected to be at % and % respectively for the next 5-year period.
Global main Underfill players cover Henkel, WON CHEMICAL, NAMICS, and SUNSTAR, etc. In terms of revenue, the global largest two companies occupy a share nearly % in 2021.
This report presents a comprehensive overview, market shares, and growth opportunities of Underfill market by product type, application, key manufacturers and key regions and countries.
Segmentation by type: breakdown data from 2017 to 2022, in Section 2.3; and forecast to 2028 in section 12.6
Semiconductor Underfills
Board Level Underfills
Segmentation by application: breakdown data from 2017 to 2022, in Section 2.4; and forecast to 2028 in section 12.7.
Industrial Electronics
Defense & Aerospace Electronics
Consumer Electronics
Automotive Electronics
Medical Electronics
Others
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the prominent manufacturers in this market, include
Henkel
WON CHEMICAL
NAMICS
SUNSTAR
Hitachi Chemical
Fuji
Shin-Etsu Chemical
Bondline
AIM Solder
Zymet
Panacol-Elosol
Master Bond
DOVER
Darbond
HIGHTITE
U-bond