This report contains market size and forecasts of Multiple Chip Package (MCP) in global, including the following market information:
Global Multiple Chip Package (MCP) Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Multiple Chip Package (MCP) Market Sales, 2017-2022, 2023-2028, (K Units)
Global top five Multiple Chip Package (MCP) companies in 2021 (%)
The global Multiple Chip Package (MCP) market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
e.MMC-Based MCP Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Multiple Chip Package (MCP) include Dosilicon, Samsung, Texas Instruments, Infineon (Cypress), Micron Technology, Macronix and Winbond Electronics Corp, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Multiple Chip Package (MCP) manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Multiple Chip Package (MCP) Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Multiple Chip Package (MCP) Market Segment Percentages, by Type, 2021 (%)
e.MMC-Based MCP
UFS-Based MCP (uMCP)
NAND-Based MCP
Global Multiple Chip Package (MCP) Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Multiple Chip Package (MCP) Market Segment Percentages, by Application, 2021 (%)
Electronic Products
Industrial Manufacture
Medical Industry
Communications Industry
Other
Global Multiple Chip Package (MCP) Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Multiple Chip Package (MCP) Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Multiple Chip Package (MCP) revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Multiple Chip Package (MCP) revenues share in global market, 2021 (%)
Key companies Multiple Chip Package (MCP) sales in global market, 2017-2022 (Estimated), (K Units)
Key companies Multiple Chip Package (MCP) sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Dosilicon
Samsung
Texas Instruments
Infineon (Cypress)
Micron Technology
Macronix
Winbond Electronics Corp