Radiation Hardened Electronic Devices and Components involve production of electronic components by hardening through radiation.
This report contains market size and forecasts of Radiation Hardened Electronic Devices and Components in global, including the following market information:
Global Radiation Hardened Electronic Devices and Components Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Radiation Hardened Electronic Devices and Components Market Sales, 2017-2022, 2023-2028, (K Units)
Global top five Radiation Hardened Electronic Devices and Components companies in 2021 (%)
The global Radiation Hardened Electronic Devices and Components market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
by Materials Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Radiation Hardened Electronic Devices and Components include Honeywell International Inc., BAE Systems, STMicroelectronics, Microchip Technology Inc., Renesas Electronics Corporation, Infineon Technologies AG, Texas Instruments, Xilinx and Analog Devices, Inc., etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Radiation Hardened Electronic Devices and Components manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Radiation Hardened Electronic Devices and Components Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Radiation Hardened Electronic Devices and Components Market Segment Percentages, by Type, 2021 (%)
by Materials
Silicon
Silicon Carbide
Gallium Nitride
Hydrogenated Amorphous Silicon
by Products
Analog And Mixed Signal/ Digital Electronic Devices
Discrete Semiconductors
Optoelectronics
Power Management
Sensors
Memory
Others
Global Radiation Hardened Electronic Devices and Components Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Radiation Hardened Electronic Devices and Components Market Segment Percentages, by Application, 2021 (%)
Aerospace
Military
Nuclear
Medical
Consumer Electronics
Others
Global Radiation Hardened Electronic Devices and Components Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Radiation Hardened Electronic Devices and Components Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Radiation Hardened Electronic Devices and Components revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Radiation Hardened Electronic Devices and Components revenues share in global market, 2021 (%)
Key companies Radiation Hardened Electronic Devices and Components sales in global market, 2017-2022 (Estimated), (K Units)
Key companies Radiation Hardened Electronic Devices and Components sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Honeywell International Inc.
BAE Systems
STMicroelectronics
Microchip Technology Inc.
Renesas Electronics Corporation
Infineon Technologies AG
Texas Instruments
Xilinx
Analog Devices, Inc.
Cobham Limited
Data Device Corporation(DDC)
Solid State Devices, Inc.
Micropac Industries, Inc.
Anaren
Maxwell Technologies Inc.
Microsemi