The semiconductor packaging wedge is a welding needle of Bonding Machine. It is used for the bonding and welding of gold wire, silver wire, copper wire and alloy wire in semiconductor packaging. It is a consumable in semiconductor packaging.
This report contains market size and forecasts of Semiconductor Packaging Wedge in global, including the following market information:
Global Semiconductor Packaging Wedge Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Semiconductor Packaging Wedge Market Sales, 2017-2022, 2023-2028, (K Units)
Global top five Semiconductor Packaging Wedge companies in 2021 (%)
The global Semiconductor Packaging Wedge market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Tungsten Carbide Wedge Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Semiconductor Packaging Wedge include ChaoZhou Three-circle (Group) Co.,Ltd., Small Precision Tools, Coorstek(GAISER), PECO, Kulicke & Soffa and Dou Yee Technologies(DYT), etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Semiconductor Packaging Wedge manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Semiconductor Packaging Wedge Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Semiconductor Packaging Wedge Market Segment Percentages, by Type, 2021 (%)
Tungsten Carbide Wedge
Titanium Wedge
Ceramic Capillary
Global Semiconductor Packaging Wedge Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Semiconductor Packaging Wedge Market Segment Percentages, by Application, 2021 (%)
Silicon Controlled Rectifier(SCR)
Surface Acoustic Wave
Light Emitting Diode(LED)
Integrated Circuit
Global Semiconductor Packaging Wedge Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Semiconductor Packaging Wedge Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Semiconductor Packaging Wedge revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Semiconductor Packaging Wedge revenues share in global market, 2021 (%)
Key companies Semiconductor Packaging Wedge sales in global market, 2017-2022 (Estimated), (K Units)
Key companies Semiconductor Packaging Wedge sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
ChaoZhou Three-circle (Group) Co.,Ltd.
Small Precision Tools
Coorstek(GAISER)
PECO
Kulicke & Soffa
Dou Yee Technologies(DYT)