Superfine solder paste refers to the solder paste product with the particle size of alloy welding powder T6-T10 in the solder paste. With the continuous development of microelectronics and semiconductor industry, the chip size is getting smaller and smaller, and the packaging density is getting higher and higher. The traditional solder paste products of T4 and above have been difficult to meet the requirements of microelectronics and semiconductor packaging, and the solder paste products used in packaging are becoming "ultra-fine" step by step.
This report contains market size and forecasts of Superfine Solder Paste in global, including the following market information:
Global Superfine Solder Paste Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Superfine Solder Paste Market Sales, 2017-2022, 2023-2028, (Kiloton)
Global top five Superfine Solder Paste companies in 2021 (%)
The global Superfine Solder Paste market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
T6 Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Superfine Solder Paste include Mitsubishi Materials Corporation., GENMA Europe GmbH, FiTech, AIM Solder, Heraeus, Henkel, Alpha, Senju Metal Industry Co., Ltd. and Indium Corporation, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Superfine Solder Paste manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Superfine Solder Paste Market, by Particle Size, 2017-2022, 2023-2028 ($ Millions) & (Kiloton)
Global Superfine Solder Paste Market Segment Percentages, by Particle Size, 2021 (%)
T6
T7
T8
Other
Global Superfine Solder Paste Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Kiloton)
Global Superfine Solder Paste Market Segment Percentages, by Application, 2021 (%)
SMT Assembly
Semiconductor Packaging
Other
Global Superfine Solder Paste Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Kiloton)
Global Superfine Solder Paste Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Superfine Solder Paste revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Superfine Solder Paste revenues share in global market, 2021 (%)
Key companies Superfine Solder Paste sales in global market, 2017-2022 (Estimated), (Kiloton)
Key companies Superfine Solder Paste sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Mitsubishi Materials Corporation.
GENMA Europe GmbH
FiTech
AIM Solder
Heraeus
Henkel
Alpha
Senju Metal Industry Co., Ltd.
Indium Corporation
TAMURA Corporation
Dyfenco International Co., Ltd.
Chip Quik
Yik Shing Tat Industrial Co., Ltd.
Shenzhen Haohaisheng New Material Technology Co., Ltd
FCT Solder
KOKI Company Ltd.