Wafer cutting surfactant is a concentrated, aqueous-based solution of wetting agents and surfactants that reduces heat build-up and move swarf particles away from the kerf during the saw dicing process.
This report contains market size and forecasts of Wafer Cutting Surfactant in global, including the following market information:
Global Wafer Cutting Surfactant Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Wafer Cutting Surfactant Market Sales, 2017-2022, 2023-2028, (Tons)
Global top five Wafer Cutting Surfactant companies in 2021 (%)
The global Wafer Cutting Surfactant market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
83.3340277777778 Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Wafer Cutting Surfactant include Dynatex International, DISCO, Versum Materials, Keteca, UDM Systems, GTA Material, Air Products, Valtech and DSK Technologies. etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Wafer Cutting Surfactant manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Wafer Cutting Surfactant Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (Tons)
Global Wafer Cutting Surfactant Market Segment Percentages, by Type, 2021 (%)
83.3340277777778
125.000694444444
208.334027777778
Others
Global Wafer Cutting Surfactant Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Tons)
Global Wafer Cutting Surfactant Market Segment Percentages, by Application, 2021 (%)
Semiconductor
IC Test
Assembly & Packaging
Global Wafer Cutting Surfactant Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Tons)
Global Wafer Cutting Surfactant Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Wafer Cutting Surfactant revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Wafer Cutting Surfactant revenues share in global market, 2021 (%)
Key companies Wafer Cutting Surfactant sales in global market, 2017-2022 (Estimated), (Tons)
Key companies Wafer Cutting Surfactant sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Dynatex International
DISCO
Versum Materials
Keteca
UDM Systems
GTA Material
Air Products
Valtech
DSK Technologies