FOSB are specialized containers for transferring wafers from one manufacturing facility to another. The 25 wafer capacity, front opening shipping box (FOSB) is used to transport wafers from one wafer supplier to wafer fabs and between wafer fab facilities.

Market Analysis and Insights: Global Wafer Transport Boxes Market
The global Wafer Transport Boxes market was valued at US$ XX in 2020 and will reach US$ XX million by the end of 2027, growing at a CAGR of XX% during 2022-2027.

Global Wafer Transport Boxes Scope and Market Size
The global Wafer Transport Boxes market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global Wafer Transport Boxes market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type and by Application for the period 2016-2027.

Segment by Type
Polypropylene
Polycarbonate
Others

Segment by Application
Below 150mm
200mm
300mm
Others

The Wafer Transport Boxes market is analysed and market size information is provided by regions (countries). Segment by Application, the Wafer Transport Boxes market is segmented into North America, Europe, China, Japan, Southeast Asia, India and Other Regions.

By Company
Entegris
Brooks Automation
Shin-Etsu Polymer
Miraial Co.,Ltd.
Pozzetta
Gudeng Precision
ePAK
Wollemi Technical Inc.